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skyshine 2017-07-08 20:55

【作者】Young-Hyun Lee
    【文章标题】ysis of silicon via hole drilling for wafer level chip stacking by UV laser

    【期刊名，年份，卷（期），起止页*****】International Journal of Precision Engineering and Manufacturing
August 2010, Volume 11, Issue 4, pp 501–507
    【全文链接】https://link.springer.com/article/10.1007/s12541-010-0055-7

szm 2017-07-10 10:25
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